Payment & Shipping Terms:
|Showroom Location:||None||Video Outgoing-inspection:||Provided|
|Machinery Test Report:||Provided||Marketing Type:||Hot Product 2019|
|Warranty Of Core Components:||1 Year||Core Components:||PLC|
|Warranty:||1 Year||Product Name:||SMT Chip Mounter Machine|
|Model Number::||YSM20 SMDCHIPMOUNTER||Applicable Components::||Nts: 0402~5050|
|Usage::||SMD LED SMT||Application::||SMT Assembly Production Line|
|Film Materials::||Privacy Material||Power Supply::||AC220V 50Hz / AC110V|
Yamaha S20 MID 3D placement machine SMT chip mounter machine S20 MID
WE are smt support provider for smt machine parts and equipment .such as feeder,nozzle , feeder storage cart smt reel rack , smt grease , solder paste mixer, smd counter, KIC thermal profiler,smt tape and so on .
Also can support some original parts of machine repair.
SMT chip mounter machine main feature:
1. Realize the 3D MID (Molded Interconnect Device) process. The new frame and inclined structure can carry out three-dimensional assembly of uneven surfaces, inclined surfaces and curved surfaces, helping customers to achieve a leap from flat panel assembly to three-dimensional assembly, and reduce assembly costs.
2. It realizes the mixed function combination of spot solder paste/red glue/patch/plug-in functions, and can be easily switched. The non-contact dispensing head can spot solder paste on the cavity substrate to realize the three-dimensional assembly of uneven surfaces.
3. Perform optical inspection on the solder paste and glue and the mounted components. The newly developed color mark recognition camera can also perform stable optical inspection on the solder paste/glue shape and the patch effect through the new lighting system (to achieve AOI +SPI function)
4, 2 types of head structures are available, 6 placement heads, 6 rotation axis types, and 12 placement heads, 2 rotation axis types.
5. Super large substrate assembly capacity, the substrate can reach 1825mmx 635mm (optional) without segmentation, the ability to pass the board at one time is 1240mm x 510mm
6. Ultra-wide range of components, from ultra-small 0201 (0.25x0.125mm) chips to 120mm large components can be processed, and the mounting height reaches 35mm, making it easy to mount ultra-high components.
7. Super large feeding capacity. The 8mm feeding port of S20 reaches 4*45=180 types, the 8mm feeding port of S10 reaches 2*45=90 types, and the waffle tray feeding 36 types can realize non-stop refueling.
8. Motor material gun and refueling cart can be interchanged with M10/M20.
MID is the abbreviation of "Molded Interconnect Device" in English. The goal of 3D-MID technology is to combine electrical and mechanical functions in a single structural unit. The circuit is integrated on the shell to replace the traditional printed circuit board, thereby effectively reducing the weight and assembly space.
The three-dimensional circuit carrier is injection molded from modified plastic. The modified plastic surface can be activated by laser irradiation to form a circuit pattern. The activated area can be metalized by electroless plating to form a conductive circuit.
Contact Person: Miss. Joy Liang