Reflow Oven 10 Zones Heller MK5 1810 SMT Machine PCB Solder Paste Reflow Oven
WE are smt support provider for smt machine parts and equipment .such as feeder,nozzle , feeder storage cart smt reel rack , smt grease , solder paste mixer, smd counter, KIC thermal profiler,smt tape and so on .
Also can support some original parts of machine repair.
PCB Solder Paste Reflow Oven
10 Zone Reflow Oven with Static Pressure / Computer Fan Speed Control of Heater Module Blowers (Three Groups; Zones Top, Bottom & Reflow Zones)
Gen5 Waterless Cooling and Flux Separation System – Heated Cooling Module in 1st Cooling Zone for Controlling Cooling Slope – Enhanced Waterless Cooling Modules for Low Product Exit Temperature.
Complete Computer Control System including:
Enhanced Low Height Heater Modules
Enhanced flow heater modules with 40% larger impellar, blanket the PCB with heat for the lowest delta Ts on the toughest boards! Additionally, the Uniform Gas Management system eliminates net flow which results in nitrogen consumption reductions of up to 40%!
New Low Height Top Shell
New low height top shell reflow oven provides much easier access for oven operators. All skins have double insulation to save up to 10-15% in energy losts.
PID temperature control to ensure zone temperature stability to +/- 1°C
Signal Light Tower to indicate system status 4 moveable casters for easy relocation around shop floor Power controlled Clamshell Hood Lift Single exhaust port for easy facilitation 480V, 60 HZ, 3 phase, 100 AMPS per phase Left to Right Process Width
Revolutionary Flux Management System
Our revolutionary flux collection system traps the flux in collection jars that can be easily removed and replaced while the oven is running – saving time consuming P.M. The new flux filtration box also has no risk of flux clogging for a longer term P.M. interval. Additionally, our proprietary Flux-Free Grill system limits the flux residue on the cooling grills giving the Heller system the highest production yields of any oven!
The new Big Flat Coil Cooling module provides cool rates of >3ºC/sec. That rate meets even the most demanding lead-free profile requirements. Heller can also easily achieve slow cooling rate required by the flip chip process. Heller’s unique design using a 10-inch (250 mm) long heater module provides more modules within the same heating length which means more process control and reduced liquid times.
Energy Management Software
Proprietary software allows you to program exhaust draw to optimize energy consumption during the various production times – heavy, light or idle. Energy savings of up to 10-20% have been realized!
Reflow Oven CPK
Heller provides dynamic 3 tiered system (Tier 1: Oven CPK, Tier 2 Process CPK, Tier 3 Product Traceability) enables customer to quickly improve product quality and yield while reducing costs. And the additional benefits of automatic record keeping and recall provide customers with the peace of mind that all process parameters are under control and within spec.
PCB Solder Paste Reflow Oven picture show